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"Let’s make Japanese sweets!" (SIED Event)

Updated Dec. 13, 2023
Imadegawa SIED will hold an event “Let’s make Japanese sweets!” ! 

Hello! We’re SIED (Imadegawa campus).
Would you like to make Kyoto sweets together?
On the day of the event, you will have the opportunity to enjoy making Japanese sweets while learning about traditional Japanese culture.
Let's make Kyoto's traditional Japanese sweets with your own hands!
We look forward to your participation!

Date & TimeJanuary 12th (Fri.) 13:30-15:30
PlaceTawaraya Yoshitomi
Participation Fee 1000 yen
Capacity30 Doshisha students
※Participants will be picked by lottery.
Application DeadlineJanuary 8th (Mon.) 17:00

Applications now open! The pre-application is required to join this event.
Please go to Application Form here.
For more details, please check the attached PDF file below.
Imadegawa SIED will hold an event “Let’s make Japanese sweets!” ! 

Hello! We’re SIED (Imadegawa campus).
Would you like to make Kyoto sweets together?
On the day of the event, you will have the opportunity to enjoy making Japanese sweets while learning about traditional Japanese culture.
Let's make Kyoto's traditional Japanese sweets with your own hands!
We look forward to your participation!

Date & TimeJanuary 12th (Fri.) 13:30-15:30
PlaceTawaraya Yoshitomi
Participation Fee 1000 yen
Capacity30 Doshisha students
※Participants will be picked by lottery.
Application DeadlineJanuary 8th (Mon.) 17:00

Applications now open! The pre-application is required to join this event.
Please go to Application Form here.
For more details, please check the attached PDF file below.
Date
Jan. 12, 2024 (Fri.)
13:30 - 15:30
Venue
Off-campus
Tawaraya Yoshitomi
Admission
  • Charged
Participation Fee: 1000 yen
Open to
  • Current Students
30 Doshisha students (Participants will be chosen by lottery.)

Application
  • Necessary
Application Deadline: January 8th (Mon.) 17:00
Please go to Application Form here.
Contact
SIED, Office of International Students, International Center
E-mail : ji-sied@mail.doshisha.ac.jp
Contact Us
Note